POLICY FOR Pb-FREE, RoHS AND GREEN ICs (PPBF-01)

PURPOSE:

This document defines our policy regarding the availability of conventional solder-plated product as well as Pb-free products.

POLICY:

It continues to be AZM’s policy to provide the highest quality products at an attractive price. We accomplish this while continuing to comply with all environmental and industry requirements and/or specific desires of our customer.

A: CONTINUED SUPPLY OF CONVENTIONAL SOLDER-PLATED ICs

AZM is committed to continue the supply of conventional solder-plated terminal as long as there is customer demand. It is anticipated, however, that demand for this package style will decrease in time after the presently scheduled date for full implementation of the RoHS (Reduction of Hazardous Substances) directive on July 1, 2006. 

B: AVAILABILITY OF RoHS-COMPLIANT Pb-FREE ICs

Following our policy, AZM was one of the first IC suppliers to proactively provide  at no additional cost, in 2004, Pb-free IC packaging which is also fully RoHS-compliant and meets or exceeds the demands of the “Directive 2002/95/EC”.

RoHS seeks to eliminate six specific substances from electronic and other equipment and components. Most notably is the elimination of 15% lead (Pb) in the solder plating of the IC terminals.

To order a product that meets this specification, simply add a “+” sign to the end of our part number.  Previously quoted prices for solder-plated IC packages will be honored whenever the customer switches to RoHS-compliant Pb-free product.

C: MOVING UP TO “GREEN”

On a part-by-part basis, AZM intends to extend the definition of Pb-free to the next level, sometimes referred to as “green”, at no additional cost. This definition removes certain halogen containing components from the package mold compounds. Also, the IC terminals are plated with 100% matte tin (Sn) or Nickel/Palladium/Gold (QFN 8, "P" package designator).

For clarity, the “green” package and terminal plating systems are fully Pb-free and also RoHS-compliant, while providing additional environmental friendliness.

“Green” Pb-free product, when available, will contain the suffix “G” in place of the “+” sign in the part number.

D: PHASING-IN “GREEN”

Phasing-in the “G” packaged ICs for previous “+” packaged ICs is expected to be a simple process requiring no additional qualifications.

E: MOISTURE SENSITIVITY

MSL (Moisture Sensitivity Level) ratings have been proven not to change from conventional solder-plated terminal packages to the “+” Pb-free and RoHS-compliant packages nor to the “G” green packages.

F: TIN WHISKER ABATEMENT

Tin whiskers are a concern with high-tin (Sn) content lead finishes. Historically the addition of lead (Pb) eliminated whiskers as a concern. However this approach is not permitted for RoHS and green parts, since the plating is 100% matte tin or Nickel/Palladium/Gold (QFN 8, "P" package designator).

AZM bakes all RoHS and green parts at 150°C for 85 minutes within 24 hours of plating to mitigate tin whisker growth.

Please contact us for further information on Green, RoHS Compliant / Lead (Pb) Free parts.

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